* Add traceback after watchdog timeout
Add the cpability to perform a traceback following a watchdog timeout.
* Enhanced hardware SPI
Allow use of either SSP0 or SSP1.
Ensure that no data is left in I/O buffers after calls to enable sharing of SSP hardware.
* Make flash emulation of eeprom the default
Make use of flash for eeprom storage the default. This means that usage of eeprom will not cause USB drive mount/unmount operations.
* Allow sharing of SD card
SD card I/O operations from the USB stack take place in idle loop, rather than at interrupt time. Allowing sharing of the SPI bus.
New configuration options to allow usage of the SD card to be specified.
* Fix problem with hardware SPI pins
* Add Formbot Raptor board
Co-Authored-By: InsanityAutomation <insanityautomation@users.noreply.github.com>
* Add a second Z probe Z offset
Co-Authored-By: InsanityAutomation <insanityautomation@users.noreply.github.com>
* Modify method to utilize live adjustment of hotend z offset
Should probably move config option to babystepping and rename as it may now apply to all multiextruder systems
* Move config item and catchup other code to current method
Indeed the HAL does not need to be mucked around with to expose ATmega2560 pins not available as numbers on the MEGA board, I'll need to update the wiki with that tidbit and a reference to the pin-mapping comment in `fastio_1280.h`.
This is an initial cut for feedback, updated for 2.0.x.
Chamber temperature is currently reported along with hot end and bed
temperatures to serial. The format is just like that used for hot end
and bed temperatures, but using 'C' prefix. As there is no heater,
target is always 0. Is this appropriate, is there a better way to report
chamber temperatures?
Chamber temperatures are not reported on the LCD in any way.
When auto chamber fan is enabled, it currently just uses the same
temperature threshold as the other auto controlled fans.
As the chamber temperature is not connected to any heater, it doesn't
undergo mintemp/maxtemp monitoring. This would need to change in the
future if chamber heating became a feature.
